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      "version": "1.0.1",
      "issued": "2025-06-20",
      "@id": "ark:/88434/mds2-3698",
      "location": "https://data.nist.gov/od/id/ark:/88434/mds2-3698",
      "description": "added to CHIPS Metrology collection"
    }
  ],
  "references": [
    {
      "@type": [
        "npg:Document"
      ],
      "@id": "#ref:10.1109/ECTC51687.2025.00078",
      "refType": "IsSupplementTo",
      "location": "https://doi.org/10.1109/ECTC51687.2025.00078",
      "_extensionSchemas": [
        "https://data.nist.gov/od/dm/nerdm-schema/bib/v0.7#/definitions/DCiteReference"
      ],
      "title": "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials",
      "issued": "2025-05-27",
      "citation": "Centellas, P., Romberg, S., Tao, R., Landauer, A. K., Schoch, K. F., Nguyen, H. G., Holmes, G., Stafford, G., & Soles, C. (2025). Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials. 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), 432\u00e2\u0080\u0093439. https://doi.org/10.1109/ectc51687.2025.00078\n"
    }
  ]
}